The recently developed Dynamic Vision Sensors (DVS) sense dynamic visual information asynchronously and code it into trains of events with sub-micro second temporal resolution. This high temporal precision makes the output of these sensors especially suited for dynamic 3D visual reconstruction, by matching corresponding events generated by two different sensors in a stereo setup. This paper explores the use of Gabor filters to extract information about the orientation of the object edges that produce the events, applying the matching algorithm to the events generated by the Gabor filters and not to those produced by the DVS. This strategy provides more reliably matched pairs of events, improving the final 3D reconstruction.

Conference Paper - Conference on Design of Circuits and Integrated Systems DCIS 2014

In this paper, a new methodology for the automated generation of the optimal performance trade-offs of integrated inductors is presented. The methodology combines a multiobjective optimization algorithm with electromagnetic simulation to get highly accurate results. A set of sized inductors is obtained showing the best performance trade-offs for a given technology. Unlike reported approaches for inductor synthesis, performance trade-offs are generated offline, i.e., before any specific inductance or quality factor are required. The tight efficiency versus accuracy trade-off of existing approaches is, in this way, avoided and performance evaluation via electromagnetic simulation becomes affordable.

Article - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 33, no. 8, pp. 1269-1273, 2014
IEEE
DOI: 10.1109/TCAD.2014.2316092   » doi
ISSN: 0278-0070

The aim of this article is to guide image sensors designers to optimize the analog-to-digital conversion of pixel outputs. The most common ADCs topologies for image sensors are presented and discussed. The ADCs specific requirements for these sensors are analyzed and quantified. Finally, we present relevant recent contributions of specific ADCs for image sensors and we compare them using a novel FOM.

Conference Paper - Image Sensors and Imaging Systems 2014

Giant Magnetoresistance (GMR) based technology is nowadays the preferred option for low magnetic fields sensing in disciplines such as biotechnology or microelectronics. Their compatibility with standard CMOS processes is currently investigated as a key point for the development of novel applications, requiring compact electronic readout. In this paper, such compatibility has been experimentally studied with two particular non-dedicated CMOS standards: 0.35 μm from AMS (Austria MicroSystems) and 2.5 μm from CNM (Centre Nacional de Microelectrònica, Barcelona) as representative examples. GMR test devices have been designed and fabricated onto processed chips from both technologies. In order to evaluate so obtained devices, an extended characterization has been carried out including DC magnetic measurements and noise analysis. Moreover, a 2D-FEM (Finite Element Method) model, including the dependence of the GMR device resistance with the magnetic field, has been also developed and simulated. Its potential use as electric current sensors at the integrated circuit level has also been demonstrated.

Article - Microelectronics Journal, vol. 45, no. 6, pp 702-707, 2014
ELSEVIER
DOI: 10.1016/j.mejo.2014.03.015   » doi
ISSN: 0026-2692

A multichannel high-resolution single-slope analogue-to-digital converter (SS ADC) is presented that automatically compensates for process, voltage and temperature variations, as well as for radiation effects, in order to be used in extreme environmental conditions. The design combines an efficient implementation by using a feedback loop that ensures an inherently monotonic and very accurate ramp generation, with high levels of configurability in terms of resolution and conversion rate, as well as input voltage range. The SS ADC was designed in a standard 0.35 μm CMOS technology. Experimental measurements of the performance and stability against radiation and temperature are presented to verify the proposed approach.

Article - Electronics Letters, vol. 50, no.8, pp 579-581, 2014
INSTITUTION OF ENGINEERING AND TECHNOLOGY-IET
DOI: 10.1049/el.2014.0664   » doi
ISSN: 0013-5194